Hexagonal graphite also known by the name white graphite. This layered material is very similar in structure to graphite. It is a good lubricant, with excellent electrical and thermal conductivity as well as chemical resistance. The article’s chemical stability makes it inert to all forms of molten metallic chemistry.
Because semiconductor chips are being developed continuously, the computer processing speed increases. As a result, chip heating has become a significant problem, which can hinder the development and advancement of chip technology. It is essential to manage thermal energy in order to develop high-performance electronics chips. Wei Dayun, a Fudan University researcher, has made tremendous progress over the past three years in the area of FET interface modification of FET sub-substrates. It is anticipated that this work will provide a novel technology for dielectric substrat modification in order to resolve the problem of chip-heat dissipation.
Wei Dacheng and his team devised a conformal hexagonal bore nitride modification (ie, quasi balanced PECVD) to fix the chip heating problem. Wei Dacheng claims that various interfaces limit the heat dissipation from the chip. Particularly important is the interface between the semiconductor, dielectric substrate, and the conductive channels.
Hexagonal, boron-nitride can be used to modify semiconductor and dielectric substrate interfaces. Numerous studies demonstrate that hexagonalboronnitride modification is capable of decreasing the carrier’s surface roughness and impact on impurities. This can also improve device carrier mobility. But, it is frequently overlooked that hexagonal Boron Nitride can be applied in the field interface heat Dissipation.
“The heat problem in the device’s heating system determines how mobile the carrier is. Higher mobility results in less heat being generated at the same power. It is how you release the heat that determines heat dissipation. Wei Dacheng explained that the heat dissipation is related to how the heat is released. “Conformal hexagonalboron nitride bonds to the substrate of the material with no gaps. No impurities are added, making it easier to achieve good results.
Wei Dacheng states that the conformal hexagonal bore nitride is made directly from the surface of the materials. Accordingly to Wei Dacheng the interface thermal resistance has been reduced and the maximum power density is 2 to 4. This is more than what is available in the computer’s CPU.
This technology has an excellent universality and offers new solutions to problems like chip heat. It can be applied on transistor devices that are based upon tungsten selenide material, but can also be extended to other materials or more application areas. Furthermore, PECVD is an industrial process that’s used frequently in chip manufacturing. Because of this, conformal hexagonal boron Nitride has great potential for mass production and use.
Future plans include developing field-effect electronic materials such as conjugated organic molecule, macromolecules, and low-dimensional Nanomaterials. Research on design principles, optoelectronics (chemical sensing), and biosensing applications will also continue.
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